Adhesives, Epoxies, Greases, Pastes
Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.
| Part Number | Manufacturer | Description | Quantity | Price | Option |
|---|---|---|---|---|---|
65-00-T630-0010
|
Parker Chomerics | THERM-A-GAP T630 0.7W/M-K 10CC | 27 | $26.91 | |
8617-85ML
|
MG Chemicals | SUPER THERM GRS ZINC OXIDE FREE | 16 | $25.87 | |
BT-401-H
|
Wakefield-Vette | SILVER FILLED BONDATHERM 2 GRAM | 49 | $25.02 | |
TC2-10G
|
Chip Quik, Inc. | HEAT SINK COMPOUND - GREY ULTRA | 16 | $21.95 | |
846-80G
|
MG Chemicals | GREASE CARBON ELEC CONDUCT 2.8OZ | 15 | $21.64 | |
8329TFF-25ML
|
MG Chemicals | FAST CURE THERM COND ADH FLOW | 33 | $21.54 | |
1977-DP
|
Techspray | TRANSISTOR SILICONE GREASE | 6 | $18.79 | |
S606N-50
|
t-Global Technology | NON SILICONE THERMAL GREASE 50G | 30 | $17.24 | |
HTS02S
|
Carlo Gavazzi Inc. | SILICONE HEATSINK PASTE 2ML | 59 | $14.17 | |
BT-101-50M
|
Wakefield-Vette | NON-SAG 5 MINUTE BONDATHERM EPOX | 98 | $12.22 |