Adhesives, Epoxies, Greases, Pastes
Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.
| Part Number | Manufacturer | Description | Quantity | Price | Option |
|---|---|---|---|---|---|
CW7100
|
Chemtronics | CONDUCTIVE SILVER GREASE SYRINGE | 48 | $48.53 | |
65-02-GEL30-0030
|
Parker Chomerics | THERM-A-GAP GEL30 3.5W/M-K 30CC | 65 | $43.89 | |
65-00-GEL30-0010
|
Parker Chomerics | THERM-A-GAP GEL30 3.5W/M-K 10CC | 86 | $32.71 | |
100200F00000G
|
Aavid, Thermal Division of Boyd Corporation | THER-O-LINK PASTE TUBE 2OZ | 20 | $22.17 | |
860-150G
|
MG Chemicals | HEAT TRANS COMPOUND SILICONE | 57 | $21.64 | |
8329TCM-6ML
|
MG Chemicals | ADHESIVE - THERMAL CONDUCTIVE EP | 40 | $19.73 | |
S606C-50
|
t-Global Technology | SILICONE THERMAL GREASE 50G JAR | 174 | $21.86 | |
1188119
|
LOCTITE | STYCAST 2850FT BLK18# 8.16KG | 37 | $185.55 | |
TG-NSP35-1LB
|
t-Global Technology | THERMAL NON-SILICONE PUTTY 1LB | 44 | $98.27 | |
A17170-01
|
Laird Technologies - Thermal Materials | TPUTTY 508 | 272 | $60.02 |