Adhesives, Epoxies, Greases, Pastes
Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.
| Part Number | Manufacturer | Description | Quantity | Price | Option |
|---|---|---|---|---|---|
S606N-30
|
t-Global Technology | NON SILICONE THERMAL GREASE 30G | 42 | $10.64 | |
TC1-10G
|
Chip Quik, Inc. | HEAT SINK COMPOUND - HIGH DENSIT | 26 | $8.95 | |
65-00-GEL30-0300
|
Parker Chomerics | THERM-A-GAP GEL30 300CC | 23 | $270.56 | |
S606C-1000
|
t-Global Technology | SILICONE THERMAL GREASE 1KG | 6 | $232.95 | |
65-00-CIP35-0200
|
Parker Chomerics | THERM-A-FORM CIP35 POTTING 200CC | 11 | $154.37 | |
65-00-TC50-0300
|
Parker Chomerics | THERM-A-GAP TC50 5.2W/M-K 300CC | 16 | $273.90 | |
65-02-TC50-0180
|
Parker Chomerics | THERM-A-GAP TC50 5.2W/M-K 180CC | 24 | $148.93 | |
120-80
|
Wakefield-Vette | SILICONE GREASE 5 LBS CAN | 20 | $138.05 | |
234476
|
LOCTITE | 3873 SELF SHIM HI COND THERM ADH | 77 | $48.86 | |
1586134
|
LOCTITE | ECCOBOND 56C-CAT 9 KIT, 140.5GM | 4 | $873.86 |