Adhesives, Epoxies, Greases, Pastes

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.

Part Number Manufacturer Description Quantity Price Option
4951G Aavid, Thermal Division of Boyd Corporation THERMALBOND EPOXY 3.5OZ PACKET 10 $66.00
BT-101-50M-EQZ Wakefield-Vette TWO DUAL CATRIDGES (BT-101-50M), 8 $65.45
65-02-T630-0030 Parker Chomerics THERM-A-GAP T630 0.7W/M-K 30CC 12 $60.98
GL-60-10 Wakefield-Vette ULTIMIFLUX GEL 10CC SYRINGE 3W/M 18 $59.39
8329TFM-50ML MG Chemicals MEDIUM CURE THERM COND ADH FLOW 16 $38.83
8329TFS-50ML MG Chemicals SLOW CURE THERM COND ADH FLOW 19 $38.83
8463-7G MG Chemicals GREASE SILVER CONDUCTIVE 0.25OZ 29 $36.38
1978-DP Techspray SILICONE FREE HEAT SINK COMP. 51 $32.95
251G Aavid, Thermal Division of Boyd Corporation THERMALCOTE GREASE CAN 1LB 67 $28.58
8616-85ML MG Chemicals SUPER THERMAL GREASE 17 $28.51