Adhesives, Epoxies, Greases, Pastes
Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.
| Part Number | Manufacturer | Description | Quantity | Price | Option |
|---|---|---|---|---|---|
TG-NSP-60 1LB
|
t-Global Technology | NON-SILICONE PUTTY 6 W/MK 1LB | 2 | $227.34 | |
A17170-03
|
Laird Technologies - Thermal Materials | TPUTTY 508 360CC EFD CARTRIDGE | 2 | $186.08 | |
BT-102-50M-EQZ
|
Wakefield-Vette | TWO DUAL CATRIDGES (BT-102-50M), | 11 | $65.45 | |
A17251-03
|
Laird Technologies - Thermal Materials | TPUTTY 607 360CC EFD CARTRIDGE | 5 | $256.67 | |
65-00-T630-0300
|
Parker Chomerics | THERM-A-GAP T630 0.7W/M-K 300CC | 11 | $167.04 | |
TG-NSP-60 4OZ
|
t-Global Technology | NON-SILICONE PUTTY 6 W/MK 4OZ | 6 | $141.12 | |
DP-100-30
|
Taica North America Corporation | THERMAL PASTE, 30CC SYRINGE | 4 | $111.74 | |
A16872-03
|
Laird Technologies - Thermal Materials | TPUTTY 403 180CC CARTRIDGE | 3 | $85.95 | |
TG-NSP25-60
|
t-Global Technology | SILICONE FREE THERMAL PUTTY 60CC | 30 | $77.91 | |
1978-1
|
Techspray | SILICONE FREE HEAT SINK | 14 | $72.11 |