Adhesives, Epoxies, Greases, Pastes

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.

Part Number Manufacturer Description Quantity Price Option
GL-08-10 Wakefield-Vette ULTIMIFLUX GEL 10CC SYRINGE 2.4W 28 $50.72
BT-403-H Wakefield-Vette ALUMINUM FILLED BONDATHERM EPOXY 38 $43.10
TC2-20G Chip Quik, Inc. HEAT SINK COMPOUND - GREY ULTRA 8 $40.95
4949G Aavid, Thermal Division of Boyd Corporation THERMALBOND EPOXY 0.875OZ PACKET 50 $37.11
BT-301-200M Wakefield-Vette FAST CURING THERMALLY CONDUCTIVE 20 $37.10
TGPK27B t-Global Technology PHASE CHANGE STICK BLUE 27G 78 $27.81
TGPK27P t-Global Technology PHASE CHANGE STICK PINK 27G 82 $27.81
TIC1000A-00-00-5CC Bergquist TIC 1000A 5CC TUBE 13 $24.83
BT-103-50M Wakefield-Vette 5 MINUTE CLEAR BONDATHERM EPOXY 35 $12.22
S606N-1000 t-Global Technology NON SILICONE THERMAL GREASE 1KG 13 $253.66