Adhesives, Epoxies, Greases, Pastes
Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.
| Part Number | Manufacturer | Description | Quantity | Price | Option |
|---|---|---|---|---|---|
8329TFS-25ML
|
MG Chemicals | SLOW CURE THERM COND ADH FLOW | 0 | $28.74 | |
S606-50
|
t-Global Technology | SILICONE THERMAL GREASE 50G JAR | 0 | $20.82 | |
8329TCS-6ML
|
MG Chemicals | ADHESIVE - THERMAL CONDUCTIVE EP | 0 | $19.73 | |
CW7250
|
Chemtronics | HEAT SINK GREASE BORON NITRIDE | 7 | $18.05 | |
8616-25ML
|
MG Chemicals | SUPER THERMAL GREASE | 0 | $15.07 | |
101800F00000G
|
Aavid, Thermal Division of Boyd Corporation | THERMAL PASTE | 22 | $13.59 | |
TC1-20G
|
Chip Quik, Inc. | HEAT SINK COMPOUND - HIGH DENSIT | 16 | $12.95 | |
BT-102-50M
|
Wakefield-Vette | TOUGHENED, FLEXIBLE ADHESIVE SYS | 8 | $12.22 | |
S606-ULR-1OZ
|
t-Global Technology | S606-ULR 1OZ CONTAINER | 0 | $11.77 | |
GF3500S35-00-60-400CC
|
Bergquist | LIQUID GAP FILLER THERMAL CONDUC | 0 | $248.27 |