Adhesives, Epoxies, Greases, Pastes
Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.
| Part Number | Manufacturer | Description | Quantity | Price | Option |
|---|---|---|---|---|---|
1188118
|
LOCTITE | STYCAST 2850FT BLK 3# 1.36KG | 0 | $122.94 | |
|
65-00-T670-0080
|
Parker Chomerics | T670 3W/M-K GREASE 80CC JAR | 0 | $82.78 | |
PL-BT-605-50M
|
Wakefield-Vette | ULTIMIFLUX 5W/MK 50ML CARTRIDGE | 0 | $61.61 | |
65-00-CIP35-0045
|
Parker Chomerics | THERM-A-FORM CIP35 POTTING 45CC | 0 | $54.62 | |
TC1-200G
|
Chip Quik, Inc. | HEAT SINK COMPOUND - HIGH DENSIT | 3 | $49.95 | |
PL-BT-603-50M
|
Wakefield-Vette | ULTIMIFLUX 3W/MK 50ML CARTRIDGE | 0 | $49.62 | |
GL-20-10
|
Wakefield-Vette | ULTIMIFLUX GEL 10CC SYRINGE 3.5W | 0 | $39.75 | |
|
65-00-TC50-0010
|
Parker Chomerics | THERM-A-GAP TC50 5.2W/M-K 10CC | 0 | $37.81 | |
8329TFF-50ML
|
MG Chemicals | FAST CURE THERM COND ADH FLOW | 3 | $29.94 | |
8329TFM-25ML
|
MG Chemicals | MEDIUM CURE THERM COND ADH FLOW | 0 | $28.74 |