Adhesives, Epoxies, Greases, Pastes

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.

Part Number Manufacturer Description Quantity Price Option
65-02-GEL30-0180 Parker Chomerics THERM-A-GAP GEL30 180CC 0 $145.55
A17170-02 Laird Technologies - Thermal Materials TPUTTY 508 0 $97.71
A17251-01 Laird Technologies - Thermal Materials TPUTTY 607 75CC EFD CARTRIDGE 329 $68.67
BT-301-50M-EQZ Wakefield-Vette TWO DUAL CATRIDGES (BT-301-50M), 0 $65.45
GF4000-00-240-50CC Bergquist GAP FILLER 4000 50CC CARTRIDGE 0 $54.10
GF3500LV-00-240-50CC Bergquist GAP FILLER 3500LV 50CC CARTRIDGE 0 $54.10
GF3500S35-07-60-50CC Bergquist LIQUID GAP FILLER THERMAL CONDU 0 $54.10
GF3500S35-00-60-50CC Bergquist GF3500S35 50CC DUAL CARTRIDGE 0 $47.05
65-02-TC50-0030 Parker Chomerics THERM-A-GAP TC50 5.2W/M-K 30CC 95 $40.97
GF1500LV-00-120-50CC Bergquist GAP FILLER 1500LV 50CC CARTRIDGE 0 $31.88