Adhesives, Epoxies, Greases, Pastes
Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.
Part Number | Manufacturer | Description | Quantity | Price | Option |
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Parker Chomerics | THERM-A-GAP GEL30 180CC | 0 | $145.55 | |
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Laird Technologies - Thermal Materials | TPUTTY 508 | 0 | $97.71 | |
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Laird Technologies - Thermal Materials | TPUTTY 607 75CC EFD CARTRIDGE | 329 | $68.67 | |
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Wakefield-Vette | TWO DUAL CATRIDGES (BT-301-50M), | 0 | $65.45 | |
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Bergquist | GAP FILLER 4000 50CC CARTRIDGE | 0 | $54.10 | |
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Bergquist | GAP FILLER 3500LV 50CC CARTRIDGE | 0 | $54.10 | |
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Bergquist | LIQUID GAP FILLER THERMAL CONDU | 0 | $54.10 | |
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Bergquist | GF3500S35 50CC DUAL CARTRIDGE | 0 | $47.05 | |
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Parker Chomerics | THERM-A-GAP TC50 5.2W/M-K 30CC | 95 | $40.97 | |
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Bergquist | GAP FILLER 1500LV 50CC CARTRIDGE | 0 | $31.88 |