Adhesives, Epoxies, Greases, Pastes
Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.
| Part Number | Manufacturer | Description | Quantity | Price | Option |
|---|---|---|---|---|---|
8616-3ML
|
MG Chemicals | SUPER THERMAL GREASE | 0 | $8.71 | |
P0200-19
|
Littelfuse Inc. | HEAT SINK COMP. SARAN PKG 2GR | 0 | $2.34 | |
|
TIC4000-00-00-5CC
|
Bergquist | TIC 4000 5CC SYRINGE | 0 | $291.14 | |
|
TIC1000A-00-00-25CC
|
Bergquist | TIC 1000A 25CC TUBE | 0 | $90.63 | |
PL-BT-601-50M
|
Wakefield-Vette | ULTIMIFLUX 1W/MK 50ML CARTRIDGE | 0 | $41.43 | |
8329TCF-50ML
|
MG Chemicals | FAST CURE EPOXY ADHESIVE | 1 | $38.83 | |
TIC4000-00-00-0.5CC
|
Bergquist | TIC 4000 0.5CC SYRINGE | 0 | $33.41 | |
|
65-00-T670-00014
|
Parker Chomerics | T670 3W/M-K GREASE 1.4CC VIAL | 0 | $26.38 | |
TG-NSP-60 1OZ
|
t-Global Technology | NON-SILICONE PUTTY 6 W/MK 1OZ | 5 | $80.17 | |
TG-NSP35-4OZ
|
t-Global Technology | THERMAL NON-SILICONE PUTTY 4OZ | 5 | $60.24 |