Adhesives, Epoxies, Greases, Pastes
Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.
Part Number | Manufacturer | Description | Quantity | Price | Option |
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GC Electronics | GREASE HTSINK TYP44 NONSIL 1.0OZ | 0 | $9.58 | |
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Laird Technologies - Thermal Materials | TPCM 780SP 20KG 5GAL PAIL | 0 | $8437.94 | |
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3M | THERMALLY CONDUCTIVE GREASE 2.5 | 0 | $8387.94 | |
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Bergquist | TIC 4000 200CC CARTRIDGE | 0 | $6380.21 | |
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Laird Technologies - Thermal Materials | TPUTTY 506 20 KG 5 GAL PAIL | 0 | $4950.23 | |
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Laird Technologies - Thermal Materials | TFLEX CR200 10 MILS 40 KG 5GAL P | 0 | $4138.50 | |
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Laird Technologies - Thermal Materials | TFLEX CR200 8 MILS 40 KG 5GAL PA | 0 | $4017.96 | |
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Laird Technologies - Thermal Materials | TFLEX CR200 40 KG 5GAL PAILS | 0 | $4002.47 | |
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Laird Technologies - Thermal Materials | THERMAL GREASE 1GAL TGREASE 2500 | 0 | $2859.62 | |
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Laird Technologies - Thermal Materials | TPUTTY 403 20 KG 5 GAL PAIL | 0 | $2707.19 |