Adhesives, Epoxies, Greases, Pastes
Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.
| Part Number | Manufacturer | Description | Quantity | Price | Option |
|---|---|---|---|---|---|
A13926-04
|
Laird Technologies - Thermal Materials | TPUTTY 504 100CC PAIL | 0 | $0.00 | |
A13926-02
|
Laird Technologies - Thermal Materials | TPUTTY 504 1000CC PAIL | 0 | $0.00 | |
1704238
|
LOCTITE | LOCTITE NSWC 100 THERMAL GREASE | 0 | $0.00 | |
S606C-30
|
t-Global Technology | SILICONE THERMAL GREASE 30G JAR | 0 | $0.00 | |
|
S606B-50
|
t-Global Technology | SILICONE THERMAL GREASE 50G JAR | 0 | $0.00 | |
|
S606-30
|
t-Global Technology | SILICONE THERMAL GREASE 30G JAR | 0 | $0.00 | |
852815
|
LOCTITE | THERMSTRATE 1000 TC 1.75 X 1.25 | 0 | $0.00 | |
A13717-03
|
Laird Technologies - Thermal Materials | TPUTTY 504 30CC SYRINGE | 0 | $0.00 | |
8610-60G
|
MG Chemicals | HEAT TRANS COMPOUND NON-SILICONE | 0 | $0.00 | |
TC2810 37ML
|
3M | THERM COND ADH TC-2810 37 ML | 0 | $0.00 |