Adhesives, Epoxies, Greases, Pastes
Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.
Part Number | Manufacturer | Description | Quantity | Price | Option |
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Laird Technologies - Thermal Materials | TPUTTY 504 55CC SYRINGE MANUAL | 0 | $0.00 | |
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Laird Technologies - Thermal Materials | TPUTTY 504 400CC PAIL | 0 | $0.00 | |
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Laird Technologies - Thermal Materials | TPUTTY 504 3KG PAIL | 0 | $0.00 | |
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Laird Technologies - Thermal Materials | TPUTTY 504 30CC SYRINGE AUTOMATI | 0 | $0.00 | |
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Laird Technologies - Thermal Materials | TPUTTY 504 305CC CARTRIDGE | 0 | $0.00 | |
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Laird Technologies - Thermal Materials | TPUTTY 504 20 KG BUCKET | 0 | $0.00 | |
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Laird Technologies - Thermal Materials | TPUTTY 504 170CC CARTRIDGE | 0 | $0.00 | |
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Laird Technologies - Thermal Materials | TPUTTY 504 10CC SYRINGE MANUAL | 0 | $0.00 | |
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Laird Technologies - Thermal Materials | TPUTTY 504 10CC SYRINGE AUTOMATI | 0 | $0.00 | |
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Laird Technologies - Thermal Materials | TPUTTY 504 100CC CARTRIDGE | 0 | $0.00 |