Adhesives, Epoxies, Greases, Pastes

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.

Part Number Manufacturer Description Quantity Price Option
A13717-05 Laird Technologies - Thermal Materials TPUTTY 504 55CC SYRINGE MANUAL 0 $0.00
A13926-01 Laird Technologies - Thermal Materials TPUTTY 504 400CC PAIL 0 $0.00
A13926-03 Laird Technologies - Thermal Materials TPUTTY 504 3KG PAIL 0 $0.00
A13717-04 Laird Technologies - Thermal Materials TPUTTY 504 30CC SYRINGE AUTOMATI 0 $0.00
A15638-01 Laird Technologies - Thermal Materials TPUTTY 504 305CC CARTRIDGE 0 $0.00
A15731-01 Laird Technologies - Thermal Materials TPUTTY 504 20 KG BUCKET 0 $0.00
A15685-00 Laird Technologies - Thermal Materials TPUTTY 504 170CC CARTRIDGE 0 $0.00
A13717-01 Laird Technologies - Thermal Materials TPUTTY 504 10CC SYRINGE MANUAL 0 $0.00
A13717-02 Laird Technologies - Thermal Materials TPUTTY 504 10CC SYRINGE AUTOMATI 0 $0.00
A15669-01 Laird Technologies - Thermal Materials TPUTTY 504 100CC CARTRIDGE 0 $0.00