Qualcomm BC57G687C-INN-E4

Manufacturer
Qualcomm
Model
BC57G687C-INN-E4
Datasheet
BC57G687C-INN-E4 PDF
Description
IC RF TXRX+MCU BLUTOOTH 105LFBGA
Availability
IN STOCK

Stock: 47

Product Detail

Attribute Name Attribute Value
Part Status Active
Supplier Device Package 44-QFN SIP (8x8)
Sensitivity -
Mounting Type Surface Mount
Package / Case 44-TQFN Exposed Pad Module
Power - Output 17dBm
Type TxRx + MCU
Data Rate (Max) 72.2Mbps
Series -
Voltage - Supply 2.75V ~ 3.6V
Protocol 802.11b/g/n
Serial Interfaces SDIO, SPI
Frequency 2.4GHz
RF Family/Standard WiFi
Packaging Tray
Current - Receiving 49mA
Modulation -
Operating Temperature -40°C ~ 85°C
Memory Size 1kB EEPROM, 160kB SRAM
Current - Transmitting 197mA

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