NXP USA Inc. S912XDQ256F1MAL

Manufacturer
NXP USA Inc.
Model
S912XDQ256F1MAL
Datasheet
S912XDQ256F1MAL PDF
Description
IC MCU 16BIT 256KB FLASH 112LQFP
Availability
OUT OF STOCK

$18.23

Product Detail

Attribute Name Attribute Value
Mounting Type Surface Mount
Core Processor Coldfire V2
Package / Case 225-LFBGA
Speed 140MHz
Data Converters A/D 6x12b
Series MCF525x
Oscillator Type External
RAM Size 128K x 8
Base Part Number MCF5253
Core Size 32-Bit
Program Memory Size -
Packaging Tray
Program Memory Type ROMless
EEPROM Size -
Operating Temperature -40°C ~ 85°C (TA)
Part Status Not For New Designs
Supplier Device Package 225-MAPBGA (13x13)
Peripherals DMA, WDT
Voltage - Supply (Vcc/Vdd) 1.08V ~ 1.32V
Connectivity CANbus, EBI/EMI, I²C, QSPI, UART/USART, USB OTG

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