Laird Technologies EMI BMI-C-006
- Manufacturer
- Laird Technologies EMI
- Model
- BMI-C-006
- Datasheet
- BMI-C-006 PDF
- Description
- CONTACT BECU 2.9X1.5MM
- Availability
- IN STOCK
Stock: 6114
Product Detail
| Attribute Name | Attribute Value |
|---|---|
| Shelf Life Start | - |
| Attachment Method | Solder |
| Type | Film Over Foam |
| Plating - Thickness | - |
| Shape | Rectangle |
| Operating Temperature | -40°C ~ 70°C |
| Width | 0.157" (4.00mm) |
| Storage/Refrigeration Temperature | - |
| Height | 0.138" (3.50mm) |
| Length | 0.118" (3.00mm) |
| Series | SMD Grounding Metallized |
| Plating | - |
| Material | Polyurethane Foam, Tin-Copper Polyester (SN/CU) |
| Shelf Life | - |
| Part Status | Active |
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