Laird Technologies EMI 67BCG2003201508R00
- Manufacturer
- Laird Technologies EMI
- Model
- 67BCG2003201508R00
- Datasheet
- 67BCG2003201508R00 PDF
- Description
- SP,CON,C,AU,TNR
- Availability
- OUT OF STOCK
$0.38
Product Detail
| Attribute Name | Attribute Value |
|---|---|
| Material | Polyurethane Foam, Tin-Copper Polyester (SN/CU) |
| Shelf Life | - |
| Part Status | Discontinued at Digi-Key |
| Shelf Life Start | - |
| Attachment Method | Solder |
| Type | Film Over Foam |
| Plating - Thickness | - |
| Shape | Rectangle |
| Operating Temperature | -40°C ~ 70°C |
| Width | 0.197" (5.00mm) |
| Storage/Refrigeration Temperature | - |
| Height | 0.197" (5.00mm) |
| Length | 0.118" (3.00mm) |
| Series | - |
| Plating | - |
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