JAE Electronics FI-XPB30SL-HF10-R3000

Manufacturer
JAE Electronics
Model
FI-XPB30SL-HF10-R3000
Datasheet
FI-XPB30SL-HF10-R3000 PDF
Description
CONN RCPT 30P 0.039 GOLD SMD R/A
Availability
OUT OF STOCK

Product Detail

Attribute Name Attribute Value
Applications General Purpose
Ingress Protection -
Contact Finish Thickness - Post -
Contact Type Center Strip Contact
Insulation Material Thermoplastic
Contact Finish Thickness - Mating 30.0µin (0.76µm)
Contact Shape -
Number of Positions 44
Mounting Type Surface Mount
Row Spacing - Mating -
Connector Type Receptacle
Contact Finish - Post Tin
Fastening Type Latch Holder
Contact Length - Post -
Style Board to Cable/Wire
Number of Rows 1
Current Rating (Amps) 0.5A per Contact
Series FI-D
Pitch - Mating 0.050" (1.27mm)
Operating Temperature -40°C ~ 85°C
Features Board Guide, Pick and Place, Solder Retention
Voltage Rating -
Mated Stacking Heights 9.35mm
Packaging Tape & Reel (TR)
Contact Material Copper Alloy
Contact Finish - Mating Gold
Part Status Obsolete
Insulation Color Black
Number of Positions Loaded All
Termination Solder
Insulation Height 0.301" (7.65mm)
Material Flammability Rating UL94 V-0

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