Epson Electronics America Inc-Semiconductor Div S1C17W03F101100-250

Manufacturer
Epson Electronics America Inc-Semiconductor Div
Model
S1C17W03F101100-250
Datasheet
S1C17W03F101100-250 PDF
Description
16-BIT MCU 4.2MHZ16KB FLASH 2KB
Availability
OUT OF STOCK

$1.9

Product Detail

Attribute Name Attribute Value
Number of I/O 15
Core Processor R8C
Speed 20MHz
Package / Case 20-LSSOP (0.173", 4.40mm Width)
Series R8C/3x/32C
Data Converters A/D 4x10b
RAM Size 512 x 8
Oscillator Type Internal
Core Size 16-Bit
Base Part Number R5F21321
Packaging Tube
Program Memory Size 4KB (4K x 8)
EEPROM Size -
Program Memory Type FLASH
Part Status Active
Operating Temperature -40°C ~ 85°C (TA)
Peripherals POR, PWM, Voltage Detect, WDT
Supplier Device Package 20-LSSOP
Connectivity I²C, LINbus, SIO, SSU, UART/USART
Voltage - Supply (Vcc/Vdd) 1.8V ~ 5.5V
Mounting Type Surface Mount

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