Epson Electronics America Inc-Semiconductor Div S1C17F57D402000

Manufacturer
Epson Electronics America Inc-Semiconductor Div
Model
S1C17F57D402000
Datasheet
S1C17F57D402000 PDF
Description
IC MCU 16BIT 32KB FLASH DIE
Availability
OUT OF STOCK

$3.72

Product Detail

Attribute Name Attribute Value
Part Status Active
Operating Temperature -40°C ~ 85°C (TA)
Peripherals DMA, LVD, POR, PWM, WDT
Supplier Device Package 40-HWQFN (6x6)
Connectivity CSI, I²C, LINbus, UART/USART
Voltage - Supply (Vcc/Vdd) 1.6V ~ 5.5V
Mounting Type Surface Mount
Number of I/O 28
Core Processor RL78
Speed 32MHz
Package / Case 40-WFQFN Exposed Pad
Series RL78/G13
Data Converters A/D 9x8/10b
RAM Size 16K x 8
Oscillator Type Internal
Core Size 16-Bit
Base Part Number R5F101
Packaging Tray
Program Memory Size 192KB (192K x 8)
EEPROM Size -
Program Memory Type FLASH

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